About Co-Pac Optics | Direct American Division of Our Manufacturer

ILLUMINATING THE FUTURE WITH CHIPS

Innovation-driven, quality-oriented photonics engineering

Founded on more than 15 years of high-speed optoelectronic R&D and backed by a 30-year compound semiconductor materials group, our manufacturing organization unites crystal growth, MOCVD epitaxial wafers, photonic chips, and high-speed 1.6T and 800G optical transceivers under one roof.

Optoelectronic R&D engineers inspecting photonic wafer instrumentation — 256+ photonics staff (>40% R&D) led by 15 to 20+ year semiconductor laser veterans

Cleanroom specialists operating semiconductor wafer and optical assembly equipment — 9,600 m² cleanroom campus spanning crystal wafers, chips, and 1.6T and 800G OSFP modules

Crystal and Substrate Division
VGF single-crystal growth and epi-ready wafer polishing across GaAs, InP, Ge, and Sapphire substrates.
Epitaxy and Chip Design Division
PhD and Master's semiconductor laser specialists with 15 to 20+ years designing VCSEL, DFB, EML, and PIN/MPD chips.
Cleanroom Process and Packaging Division
ISO Class 100/1,000 wafer fab, 6-axis sub-micron silicon-photonics coupling, and hermetic/COB optical assembly.
High-Speed Optical Module Division
256+ total team members (>40% R&D) qualifying 1.6T OSFP224 and 800G OSFP modules for AI and hyperscale switching.

How our direct American factory division works

Cleanroom Fab and Upstream Groupgrows VGF crystals, runs German AIX2800 G4 MOCVD epitaxy, and manufactures and BER-tests every 1.6T OSFP224 and 800G OSFP module.
Co-Pac Optics (U.S. Division)operates directly as the American distributor and U.S. division of the factory, managing partner allocations, technical qualification, and turnkey White-Label OEM programs.
Authorized Distributors and OEMsserve hyperscale data centers, AI clusters, and enterprise network operators under Co-Pac Optics or custom White-Label OEM branding.