1.6T · OSFP224
1.6T OSFP224 2xDR4
Integrated closed-fin top housing · Single-mode up to 500 meters · Ready for Co-Pac or White-Label OEM
American Factory Division · White-Label OEM
Coming 3.2T · Planned 20271.6T OSFP224 and 800G OSFP optical transceivers
Co-Pac Optics is the American distributor and U.S. division of its manufacturer. Supply cleanroom-built 1.6T OSFP224 and 800G OSFP transceivers up to 500 meters under Co-Pac Optics or your own custom White-Label OEM brand.
FLAGSHIP 1.6T OSFP224 · 800G OSFP
Become a distributor
Direct U.S. Allocation · Turnkey White-Label OEM Branding
15+ YrsOptoelectronic HeritageChip-to-Module R&D
9,600 m²Cleanroom CampusISO Class 100 / 1,000
256+Specialist Team(>40% R&D)
0 Errors7-Day Burn-In1.6T Loopback Verified
Jan 2027New FacilityLarge-Scale Expansion
Available Now · 1.6T OSFP224 Flagship
1.6T OSFP224 pluggable transceivers ready for distributor allocation
Two production 1.6T OSFP224 designs engineered for AI GPU clusters and leaf-spine fabrics up to 500 meters over single-mode fiber, available under Co-Pac Optics or turnkey White-Label OEM branding. Full optical, electrical, and mechanical specifications live on each product page.
1.6T · OSFP224
1.6T OSFP224 DR8
Closed-top cold-plate / RHS housing · Single-mode up to 500 meters · 2x800G or 8x200G breakout capable
Available in Volume · 800G OSFP Series
800G OSFP optical transceivers for AI Ethernet and InfiniBand NDR
Four production 800G OSFP and OSFP224 modules covering single-mode 500-meter DR4 and DR8 links plus short-reach 50-meter VR8 multimode deployments.
800G OSFP224 DR4, RHS
4-lane single-mode up to 500 meters · Riding heat sink
800G OSFP DR8, RHS, MPO-16
8-lane single-mode up to 500 meters · Riding heat sink
800G OSFP DR8, Finned-Top, MPO-16
8-lane single-mode up to 500 meters · Integrated finned top
800G OSFP VR8
8-lane OM4 multimode up to 50 meters · Short-reach rack interconnect
Turnkey White-Label OEM · We Supply the Suppliers
Put your optical brand on our 1.6T and 800G OSFP hardware
As the American distributor and U.S. division of our manufacturer, we laser-etch your brand onto 1.6T OSFP224 and 800G OSFP shells, print custom serialized barcode labels, and program CMIS 5.x vendor EEPROM registers directly on our cleanroom production line.
YOUR BRAND
PN:
YB-OSFP224-1P6TSN: CP2616008410x81 VendorName : "YOUR BRAND "
0x94 VendorPN : "YB-OSFP224-1P6T "
0xA8 MediaType : 1.6TBASE-2xDR4 (8x200G PAM4)
0xDC LaserClass : Class 1 (FDA / IEC 60825)- DIRECT U.S. FACTORY ALLOCATION
Priority 1.6T and 800G Supply
Direct cleanroom production slots coordinated through our American division, with no middleman brokers or third-party relabeling houses.
- TURNKEY BRANDING ON THE LINE
Laser-Etched and CMIS Coded
Permanent top-shell laser engraving, custom pull-tab colorways, serialized 2D labels, and CRC-verified CMIS 5.x vendor registers.
- MULTI-VENDOR QUALIFIED
7-Day Zero-Error BER Proof
Every shipment is backed by Keysight AresONE PAM4 eye characterization and continuous 7-day switch-port soak verification.
Next Optical Horizon · 2027
Coming 3.2T optical architecture, planned for 2027
Alongside active 1.6T and 800G production, our silicon-photonics and compound semiconductor engineering team is advancing a 3.2T optical transceiver, planned for 2027 for next-generation AI cluster fabrics.
Factory and Vertical Integration Advantage
Illuminating the future from crystal substrates to 1.6T light engines
Every transceiver is built inside our optoelectronic manufacturing facility within a vertically integrated R&D and semiconductor ecosystem spanning VGF crystal growth, German AIX2800 G4 MOCVD epitaxy, optical laser chips, and silicon-photonics packaging.
End-to-End Vertical Manufacturing Chain
- 01 High-purity materials
- 02 VGF substrates
- 03 MOCVD epitaxy
- 04 III-V optical chips
- 05 1.6T SiPho modules
Our upstream semiconductor group produces its own high-purity raw materials, VGF substrates, and MOCVD epitaxial wafers.
Per our manufacturing group's 2026 semiconductor and epitaxy engineering documentation.
Why Distributors and OEMs Choose Co-Pac Optics
Four cleanroom advantages built into every shipment
Vertical Wafer-to-Module Speed
In-house compound semiconductor substrates, MOCVD epitaxy, and optical chip fabrication eliminate upstream bottlenecks and stabilize lead times.
Agile Cleanroom Turnaround
Dedicated ISO Class 100/1,000 production lines scale rapidly from engineering qualification samples to volume distributor and OEM allocations.
Whole-Process Quality Control
Every transceiver is traceable from wafer metrology and die burn-in through 6-axis active coupling and 7-day zero-error BER testing.
256+ Specialist Photonics Team
Over 40% of our staff work directly in R&D, led by PhD and senior laser-chip engineers with 15 to 20+ years of industrialization experience.
Companion Interconnects
High-speed optical and copper cable assemblies
Active optical cables (AOC) and high-density breakout copper assemblies (DAC) ship alongside 1.6T and 800G transceiver allocations.
Active optical cable (AOC) assembly 
High-speed breakout cable (DAC) assembly
Validation, Certifications and Global Group Partners
Co-Pac Optics is the American distributor and U.S. division of its manufacturer.
Rooted at the intersection of light and semiconductor chips, we combine 15+ years of optoelectronic industrialization heritage, a 9,600 m² cleanroom campus, 256+ specialists (>40% R&D), and a vertically integrated compound semiconductor group with direct U.S. distribution and turnkey White-Label OEM execution.
Cleanroom Validation and Metrology
Every 1.6T and 800G module is burned in and BER-verified before shipment
7-DAY 1.6T LOOPBACKZero Post-FEC Bit Errors
Continuous 7-day 1.6T OSFP224 DR8 and 2xDR4 InfiniBand and Ethernet switch-fabric burn-in before shipment.
PAM4 RF AND EYE MASKKeysight AresONE BER Suite
Per-lane TDECQ, extinction ratio, pre-FEC BER margin, and jitter verified across 8x200G and 8x100G PAM4 lanes.
SUB-MICRON ALIGNMENT6-Axis Active SiPho Coupling
Automated sub-micron active laser-to-waveguide alignment, UV epoxy curing, and wafer-level optical probing.
TELCORDIA QUALIFIEDElevated Burn-In and Stress Lab
100% elevated-temperature module burn-in plus Telcordia GR-468-CORE thermal shock and 85 °C / 85% RH damp-heat life testing.
Quality, Safety and Regulatory Compliance
International certifications and optical standards
- QUALITY AND IT SYSTEMS
ISO 9001 · 14001 · 45001 · 20000-1
- ENTERPRISE HONORS
National High-Tech and 20+ Awards
- LASER EYE SAFETY
FDA CDRH Class 1 and IEC 60825
- SAFETY AND EMC APPROVALS
TÜV UL/CB · FCC · CE · VCCI
- ENVIRONMENTAL COMPLIANCE
SGS RoHS 2 · REACH · Halogen-Free
- MSA AND RELIABILITY
Telcordia · OSFP MSA · CMIS 5.x
Semiconductor, Photonics and Enterprise Partners
Global Semiconductor, Photonics and Technology Organizations Supplied Across Our Manufacturing Group
29 international semiconductor foundries, optical transceiver leaders, laser manufacturers, and specialty materials organizations supplied across our group's substrate, MOCVD epitaxy, chip, and optoelectronic lines.
Companies supplied across our manufacturing group's compound semiconductor, epitaxy, optical chip, and materials operations. All logos and trademarks belong to their respective owners; display indicates historical or group-level supply relationships and not endorsement of Co-Pac Optics transceivers.
Partner directly with our American division
Discuss 1.6T and 800G distributor allocation, custom White-Label OEM branding, or platform verification directly with Mike Clarke.
Direct U.S. contact: Mike Clarke · mike@co-pacoptics.com+1 (575) 910-7000